At present, the development of LED lighting has entered the fast lane. However, if the LED package cannot be improved in temperature management, reliability and optical efficiency, the overall popularity is still beyond reach. Therefore, the industry has developed COB (Chip On Board). The way LED packaging is available to meet the needs of LEDs in the lighting market. The COB package uses a metal core printed circuit board (MCPCB) to achieve the lowest thermal resistance and can operate at 24 watts for 7,000 hours at a 70°C heat sink temperature without any performance degradation. Verification of actual measurement results.
In this paper, the COB package itself and the Computational Fluid Dynamic (CFD) model building technology of the COB package with the heat sink are discussed. At the same time, the simplified or streamlined CFD simulation model is used to simplify the temperature management design of the system. This package demonstrates that COB technology is another attractive alternative to LED package design engineers due to its cost-effective features and high design flexibility.
COB package for low thermal resistance / high power efficiency
LEDs are entering the lighting market due to their excellent color saturation and long-life life. The challenges of using LEDs include temperature management and higher assembly costs. In addition, the market also requires unit light sources. Higher brightness output. The traditional method is to mount LED chips on a substrate to form discrete LED components, and then arrange these LED components on a printed circuit board (PCB) to form multiple LED light source combinations to enhance illumination. Low-power components usually use cores. The material is re-assembled for the common printed circuit board of FR4. In high-power applications, the metal core PCB is used to enhance the heat dissipation capability. The traditional method faces the limit when high brightness output density is required, because the space required for each LED substrate is required. The relatively large solder joints and the design of the LED substrate often limit the design of multi-chip circuits to a single package with low thermal resistance.
Figure 1 Anwar High-Tech 3.5W, 10.5W COB White LED Module ADJD-xDxx
A newer approach is to mount the LED chip directly on the printed circuit board, so the industry has developed a COB package with plug-and-play capability and fully integrated high-efficiency temperature management to solve these problems (Figure 1).
The main purpose of the COB package is to provide better performance than existing discrete LED components to enter the lighting market, in addition to low thermal resistance to improve reliability performance, while simplifying system design, in addition, the cost of the solution must also Can compete with other light sources.
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