Do you believe it? TSMC Announces Production of 14nm Process in 2015

It was disappointing at 40nm and 28nm, and the situation of the world’s first-generation factory TSMC is indeed not very good, but the days are always going to go and the road will continue to move forward. Shang-yi Chiang, senior vice president of TSMC’s research and development, announced today that TSMC will begin research and development of the 14nm process in 2012 and will begin mass production in 2015.

Jiang Shangyi said that TSMC will use 450mm (18 inches) new wafers to manufacture 14nm process chips, rather than the current mainstream 300mm, because larger size wafers will help reduce production costs.

Jiang Shangyi pointed out that the transition of 450mm wafers will also allow TSMC to build new factories, thereby reducing labor and land costs. He added that the biggest trouble faced by TSMC in the way to the new process is not technical difficulties, but a shortage of engineers.

TSMC previously claimed that the initial production of 450mm wafers will begin between 2013 and 2014, and then begin mass production from 2015 to 2016. However, it will initially be scheduled for the existing 300mm fab. The new plant expansion plan has not yet been announced.

Industry observers pointed out that due to the very small number of manufacturers that can support the huge investment cost of 300mm wafers, fab equipment suppliers are not willing to exert their resources. Although the 300-mm wafers are already no longer a problem in terms of production capacity, no one dared to rush into the market because of concerns about the economic situation.

Jiang Shangyi also claimed that TSMC has received enough orders to use the full capacity of the 28nm production line, and production time is still scheduled for early 2012.