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Texas Instruments (TI) announces a high-performance, filterless stereo Class D audio power amplifier that not only maximizes talk time and sound quality, but also enables handset designers to develop rich audio Functional product. Compared with the industry's closest functional solution, the TPA2012D2 can reduce quiescent current by two-thirds and white noise by 80%. Although it is packaged in a miniature package, it can provide high efficiency and sound quality to meet consumption. The need for product features and small form factor. In addition, the device is ideal for PDAs, notebooks, portable DVDs, and other types of portable audio equipment.
The 2.1 W Stereo Class D audio power amplifier is available in a small 4 mm x 4 mm ThinQFN (Quad Flat, Lead-Free) package in TI's advanced lead-free 2.0 mm x 2.0 mm wafer level package (WCSP). Designers can make the most of the space on handheld devices.
The TPA2012D2 operates from 3.3 V, consumes 6 mA, and has 27 uVRMS of Class A white noise, which is much lower than the noise level perceived by the human ear. This enables the solution to achieve more audio capabilities, clearer sound and more efficient battery usage. The device requires only two external components for proper operation, and is designed to provide four gain options and independent channel shutdown for maximum system flexibility.
The new amplifier complements TI's OMAP processor, the platform of choice for leading mobile entertainment applications such as MP3 and video streaming and TI's digital signal processor-based portable audio player solution for manufacturers A set of products optimized for the application is provided.
The TPA2012D2 is available now in lead-free ThinQFN packages and is currently available for order through TI and its authorized distributors. The suggested retail price is $0.95 in quantities of 1,000. Samples of the device in a lead-free WCSP package are also available now, with volume production expected in March 2005 and a suggested retail price of $1.05 in quantities of 1,000. The evaluation board (EVM) will be available in the first quarter of 2005.
Bluetooth Antenna, is a must component to transmit and receive electromagnetic energy in wireless communication systems.
Bluetooth antenna is divided into the following antenna:
1) Dipole antenna
The dipole antenna is usually cylindrical or flaky, and has a swivel at the bottom of the antenna as a device for energy feed to connect with the adapter of the RF front-end circuit of the Bluetooth Module.
2) PIFA antenna
The PIFA antenna is named because of its side structure is similar with inverted English letters F appearance. The operating length of PIFA antenna is only a quarter of the operating wavelength. And it included the ground metal surface so it can reduce the sensitivity of the metal surface in the module, it is very suitable for use in the Bluetooth module device.
3) Ceramic antenna
The ceramic antenna is another miniaturized antenna which is suitable for use in Bluetooth devices.
Bluetooth Antenna
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