Apple iPhone X is equipped with 3D sensing technology, which not only drives the non-Ping camp mobile phone factory to fully follow up, including auto-driving cars and advanced driver assistance systems, virtual reality and augmented reality, unmanned stores and other new applications have begun to introduce 3D sensing technology. The 3D sensing application will be popular in the US Consumer Electronics Show (CES), which will be held next week. The legal person is optimistic about the concept stocks such as fine materials, Huajingke and Yuchuang.
The company has launched a visible light 3D sensing depth map visual chip and platform solution, which can be applied to face recognition in unmanned stores. Chairman Lu Chaoqun realizes 3D sensing application.
Apple iPhone X is equipped with 3D Sensing technology, which not only drives the non-Ping camp mobile phone factory to fully follow up, including self-driving cars and advanced driver assistance systems (ADAS), virtual reality and augmented reality (VR/AR), New applications such as stores are also beginning to introduce 3D sensing technology. The 3D sensing application will be popular in the US Consumer Electronics Show (CES), which will be held next week. The legal person is optimistic about the concept stocks such as fine materials, Huajingke and Yuchuang.
Apple uses 3D sensing technology for face recognition in iPhone X, but the application of 3D sensing does not stop at face recognition. In the 2018 CES exhibition, including Qualcomm, STMicroelectronics, Infineon, ON Semi, Texas Instruments, Intel and other chip manufacturers, will showcase new 3D sensing solutions, each system factory also 3D sensing technology will be used to demonstrate the application of the new state.
At present, the mainstream technologies used in 3D sensing include TIme-of-Flight (ToF) and Structured Light. The main function is to use the optical refraction principle to obtain a 3D depth map and further measure the device end. The distance from the object. If the entire 3D sensing principle is decomposed, the operation of devices such as diffractive optical elements (DOE), CMOS image sensors, and vertical cavity surface emitting lasers (VCSELs) is still used, and different algorithms are used for measurement.
In view of the 3D sensing applications exhibited by CES in 2018, the 3D sensing applications launched by auto electronics and automotive electronics such as ADAS are based on Lidar (LiDAR) and are achieved by LiDAR or in-vehicle sensing. Automatic braking, confirmation of fatigue driving, lane offset warning and other applications.
In the Internet of Things and smart city applications, 3D sensing is used for face or person identification. On the application side, personnel access control can be implemented. Extended applications include identification and calculation for multiple people in unmanned stores. Passenger flow can also be used to detect the movement or transfer of goods, and further achieve the functions of commodity inventory management and logistics distribution.
In addition, 3D sensing allows for distance measurement and identification between machines and machines. The applications in Smart Factory and Industry 4.0 are very diverse. For example, when a semiconductor factory uses a wafer cassette to transport wafers, it can confirm each wafer at any time. Whether the box is shipped to the correct location and avoids problems such as collision of the wafer cassette during shipping.
With the launch of various applications of 3D sensing, the demand for components including DOE, CMOS image sensor and VCSEL will also explode. Taiwan's early 3D sensor supply chain optical component packaging and testing plant materials, algorithms and 3D visual digital signal processor (DSP) supplier Hua Jingke, and 3D depth of field technology will directly benefit.
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