HiDM announced that its 1.1um 1/3.2†13MP CMOS image sensor (CIS) AR1337 is in volume production and will be available in large quantities in the near future. The AR1337 supports the industry's best “twilight snapshot†phase focusing. Technology, sinking the flagship experience to 13MP mainstream phones.
In December 2016, HiDM fully acquired ON Semi's mobile phone CIS technology and patents. The experienced R&D, production and quality team quickly absorbed and transformed ON Semi's technology to realize the mass production of AR1337 in less than one year. HiDM is honored. Its products not only add new local high-end CIS options to customers, but also bring unique “light-light snapshot†experience and selling points to mid-to-high-end mobile phones through AR1337.
The HiDM management team is full of confidence and will launch a series of mid-to-high-end CIS platforms and products including HR163x (1.0um stacked 16MP) in 2018, aiming to fill and strengthen China's CIS high-end product industry chain for China's semiconductor industry. The formation of core competitiveness makes due contributions.
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