At present, some of the raw materials used in the domestic LED packaging industry (high-end chips, high-grade brackets, phosphors, and silica gel) still rely on Taiwan, the United States, Japan and other countries, especially the manufacturing of high-power LED chips is still relatively weak. With the further expansion of production capacity in the future, domestic enterprises still need to face the cost risks of importing major raw materials and the patent risks brought by the export of white LED products. How to solve the main source of raw materials, reduce costs, and better avoid the white light LED patent risk has clearly become the biggest problem facing the domestic LED packaging companies.
In the past, factors restricting the development of LED packaging technology are considered to have the following three aspects: First, the performance of key packaging materials such as substrates, organic rubber (silica gel, epoxy resin), phosphors, etc. still needs to be improved; second, high-power LED packaging The heat dissipation problem of the technology has not been completely solved; the third is that the package structure needs innovation for different applications. At present, there are some innovative strength enterprises in the key packaging raw materials in China, especially in the phosphors, including Dalian Lumei, Xiamen Kemingda, Hangzhou Daming, Beijing Yujixinguang, etc., all have certain competitiveness.
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