In order to reduce production costs, international semiconductor manufacturers and packaging and test foundry companies have shifted their packaging capacity to China, which directly drove the rapid expansion of China's semiconductor packaging industry. At the same time, the continuous expansion of China's chip manufacturing scale and the huge and fast-growing terminal electronics application market have also greatly promoted the growth of China's semiconductor packaging industry. The impact of both sides has made China's semiconductor packaging industry increasingly important in the global semiconductor packaging market despite the impact of the financial crisis.
In the early stage of industrial development, China's foreign-invested and joint-venture testing and testing companies mainly focused on packaging relatively low-to-medium products. However, as foreign and joint ventures transferred advanced packaging lines to China, products based on package substrates (ICSubstrate) have grown rapidly. BallGridAllay, ChipScalePackage, WaferLevelPackage, and System-in-Package will become mainstream. Wafer bumping (WaferBumping) has also taken shape. Through-silicon via technology (ThroughSiliconVia) has been applied to image sensors (CMOS Image Sensors) and has been mass-produced. With the support of the government's special funds, the technology of local packaging companies is also rapidly improving.
The Yangtze River Delta region is still the most promising area for the test and measurement industry. However, in order to reduce costs, in recent years, many packaging and testing companies have chosen to build new factories in the central and western regions. A number of integrated device manufacturers and packaging and foundry companies are shifting production capacity to the Midwest, a trend that will continue for several years.
China's semiconductor packaging materials market will exceed $2.2 billion in 2009, an increase of about 1% from 2008. It is expected to reach $3.1 billion in 2011.
From 2004 to 2011, the average annual compound growth rate (CAGR) is around 20%. Its main growth driver comes from the substrate, and high-end packaging materials still rely mainly on imports. In the lead frame part, several etching lines for high-end products have been added. However, the technological gap between local companies and overseas leading companies is still huge. In recent years, copper wire has gradually begun to replace gold wire, applied to products with copper wire diameter greater than 2mil and low pin count. More than 90% (in meters) of copper wire is used in discrete devices and power devices (with lead frame as the substrate). The copper wire process applied to the package substrate has also been mass-produced. For packaging companies, reducing packaging material costs and increasing production efficiency are the main effective ways to reduce costs, especially for packaging materials such as package substrates, lead frames and bonding wires. Packaging materials suppliers will face price cuts of more than 20% in the future. pressure.
China's packaging equipment market reached $452 million in 2008. Affected by the economic crisis, China's packaging equipment market is expected to decline by about 34% in 2009, to 300 million US dollars. With the rapid growth of China's packaging equipment market, some leading equipment manufacturers have set up production lines in China. However, local packaging equipment accounts for less than 15% of the Chinese market and is mainly used in the low-end market.
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